LG Innotek unveils new Flip Chip LED package

LG Innotek's Advanced Flip Chip LED package.

(South Korea) The newly developed “Advanced Flip Chip LED Package” is expected to implement stable 220 lumens per watt efficacy.

LG Innotek has developed an ‘advanced flip chip LED package’ that demonstrates high efficiency and high luminous flux without deteriorating performance, even after it gets through 300-degrees Celsius soldering process.

The high quality flip chip LED package improves reliability by applying state-of-the-art semiconductor technologies. As a result, it became possible to commercialise high efficacy and high luminous flux premium lighting products at both medium and high power.

Alongside this, it produces the high efficiency of 220 lumens per watt (lm/W) stably because the bonding between the chip and the substrate does not melt even at a temperature of 250-300-degrees Celsius. According to a representative from the company, lighting companies can use this flip chip LED package to produce premium bulbs, tubes and flat-panel lightings without sacrificing the light quality.

LG Innotek developed the package by improving its internal structure, designing its own production process, and enhancing the existing flip chip mounting technology. The internal structure of the chip is newly designed with its proprietary technology to maximise the efficacy and heat dissipation performance.

In addition, LG Innotek conducted a reliability test of more than 6,000 hours, where the flip chip package achieved stable performance even when applied to the high temperature thermal shock at the request of a customer. Due to strict quality verification process, it took two years to develop this product, considerably longer than the period required for the development of general LED packages.

LG Innotek applied for 65 new technology patents during the development process, and has taken thorough measures not only to secure its proprietary core technologies but also to help its customers to focus on manufacture and sales of the modules and finished products without worrying about patent disputes related to the light source.

A company official said: “This high-quality flip chip LED package is an innovative product that can advance the reliability of premium lightings to the new level.

“We expect that its application range will be greatly expanded as the product replaces the existing LED packages.”

www.lginnotek.com